PCB Assembly Manufacturer

Your manufacturing partner for PCB assembly and beyond.

Our printed circuit boards (PCB) assembly services are the foundation of our business, and our experienced team can quickly adapt our SMT assembly lines to accommodate simple single-layer boards or highly complex multi-layer boards with mixed placement technologies. Whether it’s Through-hole or Surface Mount Technology (SMT) assembly requirements, August has the optimal solution for all your PCB building needs. We handle both legacy designs and those incorporating lead-free micro BGA technology.

You benefit from our world-class printed circuit board assembly operation in our dedicated 85,000 sq. ft. manufacturing facility. We are proudly ISO 9001:2015 and ISO 13485:2016 certified and committed to continuously improving our processes and operations to provide superior-quality products to our clients.

Efficient PCB assembly lines

An automatic inline PCB screen printer sits at the front of each SMT line and is equipped with an optical system for fiducial alignment and paste inspection.

We have 2D and 3D solder paste inspection (SPI) equipment to ensure reliable SMT placements. This critical inspection step plays an important role in minimizing SMT board failures due to poor solder paste release.

We run four fully conveyorized SMT machines with single–or dual-head in-line placement machines. These machines are widely used in our industry as they have fast changeover times, vision-guided placement accuracy and intelligent feeder systems.

Our automatic in-line pre-reflow inspection machines verify all the components have been placed accurately before entering the reflow ovens.

Each SMT machine is anchored by a 10-zone reflow oven for maximum control over the reflow profile. Our experienced insertion operators expertly manage your leaded or lead-free assembly needs.

Our wave soldering machine utilizes three pre-heating zones to facilitate programmable flux application for soldering. Our experienced technologists can handle your leaded or lead-free assembly requirements.

Our selective soldering machine (SSM) utilizes three independent operating zones for maximum throughput and an electromagnetically operated solder delivery system for near zero-defect solder joints. We also incorporate a dual solder pot/alloy configuration to effortlessly switch between a leaded and lead-free soldering process with minimal setup required.

Our 3D automatic optical soldering inspection machine verifies solder joint quality and identifies defects such as opens, shorts and misaligned or missing electronic components.

After completing the PCB assembly process, the assembled boards are cleaned using our Trident III aqueous wash center. This system generates deionized water in a closed-loop system to minimize our environmental impact.

We have a rework station that is used when intricate board repairs are required. We have lead-free capabilities for reworking in-circuit Ball Grid Arrays (BGA), Land Grid Arrays (LGA), or Quad-flat no-leads (QFN).

PCB Board Assembly

Inspection stage of manufacturing process

Testing stage of manufacturing process occurring in PCB box build assembly services

inspections during the PCB assembly process

Quality assurance

Our PCB assembly services meet the highest quality standards throughout our assembly processes. All circuit board assemblies are barcoded and tracked through the various manufacturing steps. Our team analyzes the data collected at each stage during production to enhance and improve the process continually.

PCB inspection

Each build undergoes a rigorous first-article visual inspection, complemented by a robust NPI procedure for new products. We use your information to produce build documents and machine programs and recommend designs to streamline your products’ manufacturing process.

Our series of inspections during the PCB assembly process is designed to ensure product quality, reliability, and functionality and to reduce field failures.

Every PCB assembly* undergoes:

*excluding NPI, as NPI goes through a different process

2D or 3D Solder paste inspection (SPI)
Pre-reflow process in-line automated optical inspection (AOI)

Visual inspections
X-ray inspection
High-resolution 3D AOI final inspection

We invest in our production team’s ongoing training and professional development to keep their knowledge on the cutting edge. Click the link to learn more about our inspection and testing capabilities.

PCB testing

In addition to our quality assurance inspection steps during the assembly process, all boards have their own individual bar code for full traceability. Our detailed inspection and testing strategies are designed to predict defects in the manufacturing process, offering you cost efficiencies and confidence in your product’s reliability.

Some of our testing capabilities for prepared PCB assemblies include:

In-circuit test
Functional test
Dielectric test

Learn more about our inspection and testing capabilities or contact us to discuss your specific inspection and testing requirements.

Conformal coating & encapsulation/potting

Conformal coating and encapsulation / potting provides protection to your printed circuit boards (PCB) and box build assemblies against moisture, chemicals, dust and harsh environments with extreme temperature fluctuations.

Our experienced team knows that our clients and their end-users depend on their electronic products and assemblies performing, no matter what kind of rugged environment they are in. As your strategic electronic manufacturing services provider, we recommend the best type of coating material, thickness and coverage that would be required to protect your investment.

We have our standard conformal coat process that utilizes a tri-mode dispensing head with computer controlled selectable dispensing system complete with a conveyorized UV curing oven. The conformal coating process protects your PCBs from moisture and corrosive environments by applying a clear hard coating of acrylated urethane.

Encapsulation/potting is a better option for products or assemblies requiring a more robust form of protection from moisture, corrosion and chemicals. Our standard spray and manual mask application process enables us to apply a wide variety of encapsulation materials, such as epoxies and elastomers. Or alternatively, we can work with your engineering team to design and construct jigging or moulds during the development of a customized encapsulation process specific to your product or assembly requirements.

To enable future serviceability, our Accuflow micro blasting station utilizes awe can selectively a mild abrasive blasting media such as ground walnut shells to remove the coating to test, repair or upgrade your PCBs and assemblies.

Are your PCB assembly processes fully optimized?

Whether you are working with another contract electronics manufacturer or building in-house, it’s worth a second opinion.

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